diff --git a/README.md b/README.md index 1cb46a1..7e3118a 100644 --- a/README.md +++ b/README.md @@ -73,6 +73,30 @@ The TMI8260/CP2119 has protection features that allow it to protect **ITSELF** # Parts included in the kit: ![](images/content.jpeg) * Breakout PCB -* TMI8260SP-MS chip [(datasheet in Chinese)](datasheets/TMI8260SP-MS.pdf) +* TMI8260SP-MS chip * Polymer aluminium capacitor (SHENGYANG SM227M025E0600 220uF 25V) * 3x Ceramic capacitors (10uF 25V 0603) + + +# Documentation +![Schematic](images/schematic.png) +![PCB](image/pcb.png) +[TMI8260SP-MS datasheet (in Chinese)](datasheets/TMI8260SP-MS.pdf) + + +# Future improvements +### Thermal management +![](images/thermal.jpeg) +* Most of the heat from the IC seems to be dissipating though the OUT1 / OUT2 pins +* Therefore, the OUT1 / OUT2 polygons should be enlarged, for better cooling +* Maybe the IC should be moved more towards the middle of the board +* Right now the board can barely handle 5A + +### Solderability +* The large cap is very difficult to solder + * Some thermal reliefs can make it much easier, while probably not impacting performance in any significant way +* The optional flyback diodes are difficult to solder + * The footprint should be made hand-solderable (by enlarging the pad by a lot) + +--- +Made at [ELAB](http://elab.kth.se) by Marek Baczynski. Find him on the ELAB slack if you have any questions diff --git a/images/pcb.png b/images/pcb.png new file mode 100644 index 0000000..618f092 Binary files /dev/null and b/images/pcb.png differ diff --git a/images/schematic.png b/images/schematic.png new file mode 100644 index 0000000..8633daf Binary files /dev/null and b/images/schematic.png differ diff --git a/images/thermal.jpeg b/images/thermal.jpeg new file mode 100644 index 0000000..d692d0a Binary files /dev/null and b/images/thermal.jpeg differ