Screenshots from kicad and last touch of readme

Marek Baczynski 4 weeks ago
parent b27b8169ce
commit 5a054363ae

@ -73,6 +73,30 @@ The TMI8260/CP2119 has protection features that allow it to protect **ITSELF**
# Parts included in the kit: # Parts included in the kit:
![](images/content.jpeg) ![](images/content.jpeg)
* Breakout PCB * Breakout PCB
* TMI8260SP-MS chip [(datasheet in Chinese)](datasheets/TMI8260SP-MS.pdf) * TMI8260SP-MS chip
* Polymer aluminium capacitor (SHENGYANG SM227M025E0600 220uF 25V) * Polymer aluminium capacitor (SHENGYANG SM227M025E0600 220uF 25V)
* 3x Ceramic capacitors (10uF 25V 0603) * 3x Ceramic capacitors (10uF 25V 0603)
# Documentation
![Schematic](images/schematic.png)
![PCB](image/pcb.png)
[TMI8260SP-MS datasheet (in Chinese)](datasheets/TMI8260SP-MS.pdf)
# Future improvements
### Thermal management
![](images/thermal.jpeg)
* Most of the heat from the IC seems to be dissipating though the OUT1 / OUT2 pins
* Therefore, the OUT1 / OUT2 polygons should be enlarged, for better cooling
* Maybe the IC should be moved more towards the middle of the board
* Right now the board can barely handle 5A
### Solderability
* The large cap is very difficult to solder
* Some thermal reliefs can make it much easier, while probably not impacting performance in any significant way
* The optional flyback diodes are difficult to solder
* The footprint should be made hand-solderable (by enlarging the pad by a lot)
---
Made at [ELAB](http://elab.kth.se) by Marek Baczynski. Find him on the ELAB slack if you have any questions

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